• Adaptivity (3D solid)

    • Large material deformation

    • Thermal-mechanical coupling

    • Explicit/implicit analysis

  • Smoothed Particle Galerkin (SPG)

    • 3D solid

    • Extremely large deformation

    • Semi-brittle and ductile material failure

    • Thermal​-mechanical coupling

    • Explicit analysis

  • Geometric multi-scale modeling

    • PCB Solders

    • Joints (rivet, spot weld, FDS)

    • Reliability, performance, crashworthiness

  • Sub-cycling

  • Non-conforming cross-scale coupling

  • MPI-based data exchange

  • Eulerian Method and Mesh Motion